Application of polishing pad in chemical mechanical polishing

Polishing pads are also called polishing skins, polishing cloths, polishing pads, and are important auxiliary materials that determine the surface quality in chemical mechanical polishing.

Polishing pads can be divided into abrasive polishing pads and non-abrasive polishing pads according to whether they contain abrasives; according to different materials, they can be divided into polyurethane polishing pads, non-woven polishing pads, and composite polishing pads; according to the different surface structures, they can be roughly divided into flat type, grid type, and spiral line type.

Here is the content list:

l What is the role of the polishing pad in the processing of the workpiece on the surface grinding machine?

l How many ways are there for polishing?

l Influencing factors of a polishing pad

What is the role of the polishing pad in the processing of the workpiece on the surface grinding machine?

The polishing pad transports the polishing liquid to different areas of the polishing pad effectively and evenly; the polishing pad smoothly discharges the reactants and debris that have been fully chemically reacted after polishing to achieve the removal effect;

Maintain the polishing liquid film on the surface of the polishing pad so that the chemical reaction can fully proceed; the polishing pad maintains the smoothness of the polishing process and the surface is not deformed, to obtain a better surface morphology of the wafer.

How many ways are there for polishing?

There are many traditional material planarization technologies, such as heat flow method, etch-back method, rotating glass method, electron surrounds resonance method, low-pressure CVD, selective deposition, deposition-etch-deposition, plasma-enhanced CVD, etc. The planarization process has been applied in the development. Because these technologies belong to the local planarization technology of materials, to achieve global planarization, the use of polishing pads for chemical mechanical polishing technology has gradually begun to develop.

The polishing pad is one of the important consumables that determine the polishing rate and planarization ability in the CMP process. To play a better role with the abrasive, the polishing pad usually has certain mechanical properties and porous water absorption characteristics. Holes can help transfer abrasives and improve polishing uniformity.

There are three basic types of polishing pads: polyurethane polishing pads, non-woven polishing pads, and fluff structure polishing pads.

Influencing factors of a polishing pad

Hardness: The hardness of the polishing pad determines the ability to maintain the accuracy of the surface; compression ratio: the compression ratio reflects the anti-deformation ability of the polishing pad; Conservation: the conservation of the polishing pad is the quality of the polishing liquid stored per unit volume of the polishing pad; Roughness: Surface roughness is the degree of unevenness on the surface of the polishing pad; Density: Density is the degree of compactness of the polishing pad material;

Today, polishing pad factories have been well developed, with a wide range of sales, and gradually tend to be in line with international standards. Therefore, different manufacturers will choose different polishing pads. Whether it is an ordinary polishing pad or a super polishing pad. The polishing pad produced by Hubei Little Ant Diamond Tools CO., Ltd. is the best choice for a dry polishing pad.